Patent Assignment
Reel/Frame 066335/0165
Assignment of Assignor's Interest
Recorded: 2024-02-02
Pages: 4
Assignor
KIM, HONGJIN
Executed: 2023-12-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Application:
18/391,942 →
Publication:
US 2024/0347499