Patent Assignment
Reel/Frame 066395/0959
Assignment of Assignor's Interest
Recorded: 2024-02-06
Pages: 6
Assignors
OH, YOUNGTEK
Executed: 2023-09-12
KIM, DONGHO
Executed: 2023-09-12
PARK, JOONYONG
Executed: 2023-09-12
HWANG, JUNSIK
Executed: 2023-09-12
KIM, DONGKYUN
Executed: 2023-09-12
SONG, SANGHOON
Executed: 2023-09-12
YU, MINCHUL
Executed: 2023-09-12
HWANG, KYUNGWOOK
Executed: 2023-09-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Micro Semiconductor Chip Transfer Method and Micro Semiconductor Chip Transfer Device
Application:
18/433,068 →
Publication:
US 2024/0322068