Patent Assignment
Reel/Frame 066405/0728
Assignment of Assignor's Interest
Recorded: 2024-02-07
Pages: 7
Assignors
CHAE, HEEJAE
Executed: 2023-09-01
PARK, TAEJIN
Executed: 2023-09-01
LEE, HYUNJIN
Executed: 2023-09-01
LEE, HOSANG
Executed: 2023-09-01
CHOI, YUN
Executed: 2023-09-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices and Methods of Manufacturing the Same
Application:
18/435,231 →
Publication:
US 2024/0284662