Patent Assignment
Reel/Frame 066420/0038
Assignment of Assignor's Interest
Recorded: 2024-02-08
Pages: 6
Assignors
PARK, JISOO
Executed: 2024-01-18
KANG, BYUNGJU
Executed: 2024-01-18
LIM, JAEHYOUNG
Executed: 2024-01-18
CHUN, KWANYOUNG
Executed: 2024-01-18
CHOI, SUBIN
Executed: 2024-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Device and Method of Fabricating the Same
Application:
18/435,305 →
Publication:
US 2025/0072106