Patent Assignment
Reel/Frame 066455/0647
Assignment of Assignor's Interest
Recorded: 2024-02-13
Pages: 6
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Ultrathin Solid State Dies and Methods of Manufacturing the Same