Patent Assignment
Reel/Frame 066512/0795
Assignment of Assignor's Interest
Recorded: 2024-02-21
Pages: 4
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Processing Method of Bonded Wafer
Application:
18/582,983 →
Publication:
US 2024/0297052