Patent Assignment
Reel/Frame 066514/0719
Assignment of Assignor's Interest
Recorded: 2024-02-21
Pages: 8
Assignors
LIN, YUSHENG
Executed: 2019-07-08
CARNEY, FRANCIS J.
Executed: 2019-07-08
CHEW, CHEE HIONG
Executed: 2019-07-08
YASUDA, SHUNSUKE
Executed: 2019-07-08
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Pre-Stacking Mechanical Strength Enhancement of Power Device Structures
Application:
18/444,221 →
Publication:
US 2024/0186285