Patent Assignment
Reel/Frame 066533/0596
Assignment of Assignor's Interest
Recorded: 2024-02-22
Pages: 5
Assignors
WANG, ZHIQIANG
Executed: 2024-02-21
DONG, HANGHANG
Executed: 2024-02-05
HU, XIAOFENG
Executed: 2024-02-05
YANG, JUNJIE
Executed: 2024-02-05
Assignee
HONOR DEVICE CO., LTD.
SUITE 3401, UNIT A, BUILDING 6, SHUM YIP SKY PARK, NO. 8089, HONGLI WEST ROAD, XIANGMIHU STREET, FUTIAN DISTRICT, SHENZHEN, 518040, CHINA
Covered Property
(1)
Method for Manufacturing Heat Dissipation Structure of Electronic Element, Heat Dissipation Structure, and Electronic Device