Patent Assignment
Reel/Frame 066536/0262
Assignment of Assignor's Interest
Recorded: 2024-02-22
Pages: 5
Assignors
YIN, LI-CHAO
Executed: 2019-06-28
CHIU, YULING
Executed: 2019-07-09
YANG, YU-LUNG
Executed: 2019-07-09
LIN, HUNG-BIN
Executed: 2019-07-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Apparatus for Processing Substrates or Wafers
Application:
18/584,828 →
Publication:
US 2024/0249957