Patent Assignment
Reel/Frame 066579/0077
Assignment of Assignor's Interest
Recorded: 2024-02-27
Pages: 6
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same
Application:
18/587,425 →
Publication:
US 2025/0070021