Patent Assignment
Reel/Frame 066634/0476
Assignment of Assignor's Interest
Recorded: 2024-03-04
Pages: 4
Assignors
LIAO, CHEN HAO
Executed: 2024-03-03
LEE, CHIH-TSUNG
Executed: 2024-01-11
LIN, MING-YI
Executed: 2024-01-18
WU, CHENG-LUNG
Executed: 2024-01-11
PAI, JIUN-RONG
Executed: 2024-02-14
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-78, TAIWAN
Covered Property
(1)
Seismic Event Displacement Mitigation