Patent Assignment
Reel/Frame 066637/0182
Assignment of Assignor's Interest
Recorded: 2024-03-04
Pages: 6
Assignors
HAM, TAEWOOK
Executed: 2024-01-24
KWON, MOONHYUNG
Executed: 2024-01-24
YUN, YOUNGGIRL
Executed: 2024-01-24
CHOI, TAEKKYUN
Executed: 2024-01-24
HEO, WONHYUNG
Executed: 2024-02-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Comprising Heat Dissipation Structure
Application:
18/594,595 →
Publication:
US 2024/0206120