Patent Assignment
Reel/Frame 066667/0690
Assignment of Assignor's Interest
Recorded: 2024-03-06
Pages: 5
Assignors
FUCHII, MASASHI
Executed: 2023-12-13
DING, YIMEI
Executed: 2023-12-13
IIZUKA, NAOKI
Executed: 2023-12-13
MARUYAMA, HIDENOBU
Executed: 2023-12-13
ANEGAWA, KENTA
Executed: 2023-12-14
KANAI, YASUTO
Executed: 2023-12-15
Assignee
SEIKO EPSON CORPORATION
1-6, SHINJUKU 4-CHOME, SHINJUKU-KU, TOKYO, 160-8801, JAPAN
Covered Property
(1)
Injection Molding System