Patent Assignment
Reel/Frame 066723/0901
Assignment of Assignor's Interest
Recorded: 2024-03-12
Pages: 5
Assignors
NASMAN, RONALD
Executed: 2024-02-27
D'ELIA, PETER
Executed: 2024-02-27
HU, SHAN
Executed: 2024-02-27
GROOTEGOED, JAMES
Executed: 2024-02-29
ROBISON, RODNEY
Executed: 2024-02-28
DEVILLIERS, ANTON
Executed: 2024-03-11
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, AKASAKA BIZ TOWER, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Novel Wafer Chuck Designs And Methods For Retaining A Processing Liquid On A Surface Of A Semiconductor Wafer