IP Library › Assignment 066762/0602
Patent Assignment
Reel/Frame 066762/0602

Corrective Assignment to Correct the 1ST and 4TH Inventor's Execution Dates Previously Recorded at Reel: 65735 Frame: 168. Assignor(S) Hereby Confirms the Assignment .

Recorded: 2024-03-08 Pages: 5
Assignors
WU, I-WEN
Executed: 2021-01-06
LEE, CHEN-MING
Executed: 2021-01-06
YANG, FU-KAI
Executed: 2021-01-06
WANG, MEI-YUN
Executed: 2021-01-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD., 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Semiconductor Device Contact Structures and Methods of Fabricating Thereof
Application: 18/519,714 →
Publication: US 2024/0096985
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2023
From: WU, I-WEN; LEE, CHEN-MING; YANG, FU-KAI; WANG, MEI-YUN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 065735/0168 →