Patent Assignment
Reel/Frame 066797/0410
Entity to Entity Assignment
Recorded: 2024-03-14
Pages: 3
Assignor
AEM HOLDINGS LTD.
Executed: 2024-03-09
Assignee
AEM SINGAPORE PTE. LTD.
52 SERANGOON NORTH AVENUE 4, SINGAPORE, 555853, SINGAPORE
Covered Properties
(2)
Thermal Control Wafer with Integrated Heating-Sensing Elements
Patent:
12,085,609 →
Application:
18/454,737 →
Thermal Control Wafer with Integrated Heating-Sensing Elements
Patent:
12,013,432 →
Application:
18/454,741 →
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 14, 2024
From: OSTROWSKI, CARL L.; CONNACHER, TERRY SINCLAIR; ALEMAN, ENRIQUE; DINESCU, SORIN
To: AEM INTERNATIONAL (US) LTD.
Reel/Frame 066773/0062 →
Assignment of Assignor's Interest
Mar 14, 2024
From: KABBANI, SAMER
To: AEM HOLDINGS LTD.
Reel/Frame 066773/0067 →
Assignment of Assignor's Interest
Mar 14, 2024
From: JONES, THOMAS P.
To: AEM AMERICAS, INC.
Reel/Frame 066773/0070 →
Entity to Entity Assignment
Mar 14, 2024
From: AEM AMERICAS, INC.
To: AEM SINGAPORE PTE. LTD.
Reel/Frame 066797/0403 →
Entity to Entity Assignment
Mar 14, 2024
From: AEM INTERNATIONAL (US) LTD.
To: AEM SINGAPORE PTE. LTD.
Reel/Frame 066797/0413 →