Patent Assignment
Reel/Frame 066803/0168
Assignment of Assignor's Interest
Recorded: 2024-03-17
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus and Substrate Processing Method Using the Same
Application:
18/410,382 →
Publication:
US 2025/0029845