Patent Assignment
Reel/Frame 066829/0283
Assignment of Assignor's Interest
Recorded: 2024-03-19
Pages: 4
Assignors
CHEN, CHAO-HSUAN
Executed: 2024-03-11
YANG, I-WEI
Executed: 2024-03-10
KU, SHU-YUAN
Executed: 2024-03-11
CHEN, RYAN CHIA-JEN
Executed: 2024-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Methods of Forming the Same
Application:
18/414,702 →
Publication:
US 2025/0234594