IP Library › Assignment 066860/0090
Patent Assignment
Reel/Frame 066860/0090

Assignment of Assignor's Interest

Recorded: 2024-03-21 Pages: 5
Assignors
HUANG, HSIN-YEN
Executed: 2019-09-06
LEE, SHAO-KUAN
Executed: 2019-09-06
LEE, CHENG-CHIN
Executed: 2019-09-06
CHEN, HAI-CHING
Executed: 2019-09-06
SHUE, SHAU-LIN
Executed: 2019-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Selective Deposition for Integrated Circuit Interconnect Structures
Application: 18/608,673 →
Publication: US 2024/0258166
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the the Attorney Docket Number Previously Recorded at Reel: 66860 Frame: 90. Assignor(S) Hereby Confirms the Assignment. Apr 8, 2024
From: HUANG, HSIN-YEN; LEE, SHAO-KUAN; LEE, CHENG-CHIN; CHEN, HAI-CHING
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 067040/0308 →