Patent Assignment
Reel/Frame 066889/0088
Assignment of Assignor's Interest
Recorded: 2024-03-25
Pages: 5
Assignors
LAI, WEI-AN
Executed: 2021-05-23
PENG, SHIH-WEI
Executed: 2021-05-19
TZENG, JIANN-TYNG
Executed: 2021-05-19
WANG, CHUNG-HSING
Executed: 2021-05-19
CHIU, TE-HSIN
Executed: 2021-08-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Backside Conducting Lines in Integrated Circuits
Application:
18/615,462 →
Publication:
US 2024/0266345