Patent Assignment
Reel/Frame 066889/0589
Assignment of Assignor's Interest
Recorded: 2024-03-25
Pages: 3
Assignor
PAEK, JONG SIK
Executed: 2021-07-11
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property
(1)
Stacked Die Modules for Semiconductor Device Assemblies and Methods of Manufacturing Stacked Die Modules