Patent Assignment
Reel/Frame 066891/0319
Assignment of Assignor's Interest
Recorded: 2024-03-25
Pages: 4
Assignors
MAY, ROBERT ALAN
Executed: 2016-10-14
JEN, WEI-LUN KANE
Executed: 2016-10-13
ROSCH, JONATHAN
Executed: 2016-10-13
SALAMA, ISLAM A.
Executed: 2016-10-18
DARMAWIKARTA, KRISTOF
Executed: 2016-10-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Device and Method of Very High Density Routing Used with Embedded Multi-Die Interconnect Bridge