Patent Assignment
Reel/Frame 066891/0874
Assignment of Assignor's Interest
Recorded: 2024-03-25
Pages: 6
Assignors
SONG, HYEON DONG
Executed: 2024-01-02
MOON, JUN YOUNG
Executed: 2024-01-02
PARK, SANG WOO
Executed: 2024-01-02
JEONG, UN KI
Executed: 2024-01-02
UH, JI HO
Executed: 2024-01-02
CHUN, HYUN SOO
Executed: 2024-01-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus
Application:
18/413,491 →
Publication:
US 2024/0278437