Patent Assignment
Reel/Frame 066896/0204
Assignment of Assignor's Interest
Recorded: 2024-03-26
Pages: 3
Assignors
SON, HO YOUNG
Executed: 2021-02-22
KIM, SUNG KYU
Executed: 2021-02-22
LEE, MI SEON
Executed: 2021-02-22
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, 17336, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Including Through Electrode, and Semiconductor Package Including the Same