Patent Assignment
Reel/Frame 066896/0479
Assignment of Assignor's Interest
Recorded: 2024-03-26
Pages: 8
Assignors
IM, SEUNGWON
Executed: 2017-08-30
JEON, OSEOB
Executed: 2017-08-30
LEE, BYOUNGOK
Executed: 2017-08-30
LEE, YOONSOO
Executed: 2017-08-30
LEE, DUKYONG
Executed: 2017-08-30
SON, JOONSEO
Executed: 2017-09-24
PARK, CHANGYOUNG
Executed: 2017-09-22
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Semiconductor Package Having Cooling Systems with Flow Control Devices within Substrates
Application:
18/616,351 →
Publication:
US 2024/0234246