Semiconductor package having cooling systems with flow control devices within substrates
Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
1 . A semiconductor package comprising:
a first cover coupled to a first substrate, the first substrate coupled to a first die;
a first cooling system comprised within the first substrate;
a second cover coupled to a second substrate, the second substrate coupled to a second die;
a second cooling system comprised within the second substrate; and
a spacer coupled between a surface on the first die facing the second substrate and a surface of the second die facing the first substrate;
wherein the first cooling system and the second cooling system each comprise a flow control device configured to induce turbulent flow of a cooling medium passing through the first cooling system and the second cooling system.
2 . The semiconductor package of claim 1 , wherein the flow control device comprises a heat slug with fins.
3 . The semiconductor package of claim 1 , wherein the spacer is directly coupled to the first die and the second die.
4 . The semiconductor package of claim 1 , wherein the each of the first substrate and the second substrate comprise an outer layer directly coupled to a dielectric layer.
5 . The semiconductor package of claim 4 , wherein the first substrate comprises a patterned layer directly coupled between the dielectric layer and the first die.
6 . The semiconductor package of claim 1 , wherein the first cover and the second cover comprise a water jacket.
7 . The semiconductor package of claim 1 , wherein the first cover and the second cover each comprises nickel plated copper.
8 . A semiconductor package comprising:
a first cover coupled to a first substrate, the first substrate comprising an outer layer, the first substrate coupled to a first die;
a first cooling system comprised within the outer layer;
a second cover coupled to a second substrate, the second substrate comprising a second outer layer, the second substrate coupled to a second die;
a second cooling system comprised within the second outer layer; and
a spacer coupled between the first die and the second die;
wherein the first substrate comprises a dielectric layer directly coupled to the outer layer and the second substrate comprises a second dielectric layer directly coupled to the second outer layer; and
wherein the first cooling system and the second cooling system each comprise a flow control device configured to induce turbulent flow of a cooling medium passing through the first cooling system and the second cooling system.
9 . The semiconductor package of claim 8 , wherein the flow control device comprises a heat slug with fins.
10 . The semiconductor package of claim 8 , wherein the spacer is directly coupled between a surface of the first die facing the second substrate and a surface of the second die facing the first substrate.
11 . The semiconductor package of claim 8 , wherein the first substrate comprises a patterned layer directly coupled between the dielectric layer and the first die.
12 . The semiconductor package of claim 8 , wherein the first cover and the second cover comprise a water jacket.
13 . The semiconductor package of claim 8 , wherein the first cover and the second cover each comprises nickel plated copper.