Patent Assignment
Reel/Frame 066938/0891
Assignment of Assignor's Interest
Recorded: 2024-03-28
Pages: 4
Assignors
PARK, SANGJINE
Executed: 2024-01-17
PARK, JIHWAN
Executed: 2024-01-17
LEE, KUNTACK
Executed: 2024-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus, Substrate Processing Method, and Method of Manufacturing Semiconductor Device
Application:
18/407,631 →
Publication:
US 2024/0242985