Patent Assignment
Reel/Frame 066953/0032
Assignment of Assignor's Interest
Recorded: 2024-03-29
Pages: 18
Assignors
ELASHRI, ALI
Executed: 2021-12-08
MEGARITY, WILLIAM MARK
Executed: 2021-12-08
CONROY, RYAN F
Executed: 2021-12-08
AGARWAL, CHETAN SANJAY
Executed: 2021-12-09
CHOUDHARY, PRITI
Executed: 2024-03-28
Assignee
AMAZON TECHNOLOGIES, INC.
P.O. BOX 81226, SEATTLE, WASHINGTON, 98108-1226
Covered Property
(1)
Heat Sinks for Bare Die Multi-Chip Packages
Patent:
12,222,776 →
Application:
17/547,919 →