Patent Assignment
Reel/Frame 066962/0701
Assignment of Assignor's Interest
Recorded: 2024-04-01
Pages: 6
Assignors
NAKAKO, HIDEO
Executed: 2024-03-13
EJIRI, YOSHINORI
Executed: 2024-03-13
TANAKA, TOSHIAKI
Executed: 2024-03-19
ISHIKAWA, DAI
Executed: 2024-03-25
NATORI, MICHIKO
Executed: 2024-03-25
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property
(1)
Metal Paste for Bonding, and Bonded Body and Method for Producing Same
Application:
18/575,136 →
Publication:
US 2024/0424614
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.