Patent Assignment
Reel/Frame 067066/0064
Assignment of Assignor's Interest
Recorded: 2024-04-10
Pages: 5
Assignors
CHIEN, YU-JEN
Executed: 2021-06-22
WU, JUNG-TANG
Executed: 2021-07-15
WU, SZU-HUA
Executed: 2021-06-22
LEE, CHIN-SZU
Executed: 2021-06-30
WU, MENG-YU
Executed: 2022-06-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Mram Device Between Adjacent Metal Line Layers and Mram Device
Application:
18/631,813 →
Publication:
US 2024/0260479