Patent Assignment
Reel/Frame 067075/0900
Assignment of Assignor's Interest
Recorded: 2024-04-11
Pages: 4
Assignor
RIVA, CARLO
Executed: 2024-03-11
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20864, ITALY
Covered Property
(1)
Polycrystalline Silicon Carbide Substrate with Density Gradient and Method of Manufacturing the Same
Application:
18/614,522 →
Publication:
US 2024/0332366
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 11, 2024
From: MAGNUSSON LINDGREN, BJÖRN
To: STMICROELECTRONICS SILICON CARBIDE AB
Reel/Frame 067075/0896 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS SILICON CARBIDE AB
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068024/0077 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0001 →