Patent Assignment
Reel/Frame 068024/0077
Assignment of Assignor's Interest
Recorded: 2024-07-18
Pages: 6
Assignor
STMICROELECTRONICS SILICON CARBIDE AB
Executed: 2024-07-09
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(3)
Low Resistivity Polycrystalline Based Substrate or Wafer
Application:
18/614,485 →
Publication:
US 2024/0332365
Polycrystalline Silicon Carbide Substrate with Density Gradient and Method of Manufacturing the Same
Application:
18/614,522 →
Publication:
US 2024/0332366
Polycrystalline Silicon Carbide Substrate and Method of Manufacturing the Same
Application:
18/614,538 →
Publication:
US 2024/0332011
Related Assignments
(7)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 11, 2024
From: MAGNUSSON LINDGREN, BJÖRN
To: STMICROELECTRONICS SILICON CARBIDE AB
Reel/Frame 067075/0791 →
Assignment of Assignor's Interest
Apr 11, 2024
From: RIVA, CARLO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 067075/0795 →
Assignment of Assignor's Interest
Apr 11, 2024
From: MAGNUSSON LINDGREN, BJÖRN
To: STMICROELECTRONICS SILICON CARBIDE AB
Reel/Frame 067075/0896 →
Assignment of Assignor's Interest
Apr 11, 2024
From: RIVA, CARLO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 067075/0900 →
Assignment of Assignor's Interest
Apr 11, 2024
From: RIVA, CARLO
To: STMICROELECTRONICS S.R.L.
Reel/Frame 067076/0132 →
Assignment of Assignor's Interest
Apr 11, 2024
From: MAGNUSSON LINDGREN, BJÖRN; ELLISON, ALEXANDRE
To: STMICROELECTRONICS SILICON CARBIDE AB
Reel/Frame 067076/0147 →
Assignment of Assignor's Interest
Jul 18, 2024
From: STMICROELECTRONICS S.R.L.
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 068434/0001 →