IP Library Assignment 067086/0577
Patent Assignment
Reel/Frame 067086/0577

Assignment of Assignor's Interest

Recorded: 2024-04-12 Pages: 6
Assignors
KUO, SHIOU-YI
Executed: 2024-04-01
SHIU, GUO-YI
Executed: 2023-05-09
LO, CHIN-HUNG
Executed: 2024-04-01
LIN, CHIH-HAO
Executed: 2024-04-01
LI, CHENG-HSIEN
Executed: 2024-04-01
MA, WEI-YUAN
Executed: 2024-04-01
Assignee
LEXTAR ELECTRONICS CORPORATION
6F, NO 21, LIXING RD, HSINCHU SCIENCE PARK, HSINCHU CITY, 300094, TAIWAN
Covered Property (1)
Micro Light-Emitting Diode Package Structure and Forming Method Thereof
Application: 18/633,418 →
Publication: US 2024/0355986
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Mar 27, 2026
From: LEXTAR ELECTRONICS CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075286/0822 →