IP Library › Assignment 067098/0137
Patent Assignment
Reel/Frame 067098/0137

Assignment of Assignor's Interest

Recorded: 2024-03-27 Pages: 2
Assignor
Assignee
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD
NO.58, NANYUN 2ND ROAD, SCIENCE CITY, HUANGPU DISTRICT, GUANGZHOU, GUANGDONG, CHINA
Covered Property (1)
Reducing Dross Method of Lead-Free Solder
Patent: 8,557,016 →
Application: 13/125,261 →
Publication: US 2011/0219914
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 20, 2011
From: DU, KUN; CHEN, MINGHAN; CHEN, XIN; CAI, LIESONG
To: GUANGZHOU SOLDERWELL ENTERPRISE CO., LTD.
Reel/Frame 026159/0801 →
Change of Name Nov 15, 2017
From: GUANGZHOU SOLDERWELL ENTERPRISE CO., LTD.
To: GUANGZHOU SOLDERWELL ADVANCED MATERIALS CO., LTD.
Reel/Frame 044126/0363 →
Change of Name Nov 15, 2017
From: GUANGZHOU SOLDERWELL ADVANCED MATERIALS CO., LTD.
To: SOLDERWELL ADVANCED MATERIALS CO., LTD.
Reel/Frame 044126/0367 →