Patent Assignment
Reel/Frame 067104/0857
Assignment of Assignor's Interest
Recorded: 2024-04-15
Pages: 5
Assignors
IM, SEUNGWON
Executed: 2020-12-17
KANG, DONGWOOK
Executed: 2020-12-17
JEON, OSEOB
Executed: 2020-12-17
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5701 N. PIMA ROAD, SCOTTSDALE, ARIZONA, 85250
Covered Property
(1)
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms