Patent Assignment
Reel/Frame 067116/0337
Assignment of Assignor's Interest
Recorded: 2024-04-16
Pages: 5
Assignors
CUI, YINHUA
Executed: 2024-01-10
ZHENG, WEI
Executed: 2024-01-10
WANG, YAO
Executed: 2024-01-10
CHEN, ZHIKUAN
Executed: 2024-01-10
HU, CHUAN
Executed: 2024-01-04
CHEN, ZHITAO
Executed: 2024-01-10
WANG, CHANG'AN
Executed: 2024-01-10
Assignee
INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
363 CHANGXING ROAD, TIANHE DISTRICT, GUANGZHOU, 510650, CHINA
Covered Property
(1)
3D Stacked Packaging Structure and Manufacturing Method Thereof
Application:
18/417,789 →
Publication:
US 2024/0153913