IP Library › Assignment 067121/0506
Patent Assignment
Reel/Frame 067121/0506

Assignment of Assignor's Interest

Recorded: 2024-04-16 Pages: 3
Assignor
Assignees
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI-KEN, 471-8571, JAPAN
MIRISE TECHNOLOGIES CORPORATION
500-1 MINAMIYAMA, KOMENOKICHO, NISSHIN CITY, 470-0111, JAPAN
DENSO CORPORATION
1-1, SHOWA-CHO, KARIYA, AICHI, 448-8664, JAPAN
Covered Property (1)
3D Printed Cold Plates and Methods for Cooling Power Devices Embedded in 3D Printed Circuit Boards
Application: 17/529,423 →
Publication: US 2023/0152047
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 18, 2021
From: ZHOU, FENG; DEDE, ERCAN
To: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Reel/Frame 058148/0659 →