Patent Assignment
Reel/Frame 067134/0182
Assignment of Assignor's Interest
Recorded: 2024-04-17
Pages: 7
Assignors
TAKAHASHI, SEIJI
Executed: 2018-11-23
SZE, JHY-JYI
Executed: 2018-11-23
CHEN, TZU-HSIANG
Executed: 2019-01-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Pixel Device on Deep Trench Isolation (Dti) Structure for Image Sensor