Patent Assignment
Reel/Frame 067136/0001
Assignment of Assignor's Interest
Recorded: 2024-04-17
Pages: 7
Assignors
MICHAEL, MIHALIS
Executed: 2023-11-28
NAJAFI, FARZIN
Executed: 2024-04-02
ZAMIL, MOHAMMAD SHAFAYET
Executed: 2024-04-03
DIXIT, ABHINANDAN HEMANT
Executed: 2023-12-10
Assignee
GAN SYSTEMS INC.
770 PALLADIUM DRIVE, SUITE 201, OTTAWA, K2V 1C8, CANADA
Covered Property
(1)
Leaded Package Using Routing Layer for Integrated Circuit Die
Application:
18/496,549 →
Publication:
US 2025/0140665
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.