Assignment of Assignor's Interest

Recorded: 2024-04-23 Pages: 8

Assignors

JEE, SANG SOO

Executed: 2024-04-23

LEE, EUN SUNG

Executed: 2024-04-23

LEE, JUNGHOON

Executed: 2024-04-22

KWON, YOUNGNAM

Executed: 2024-04-22

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

Covered Property (1)

Composite Abrasive, Method of Preparing Same, Polishing Slurry Including Same, and Method of Manufacturing Semiconductor Device

Application: 18/312,329 →

Publication: US 2023/0357616