Patent Assignment
Reel/Frame 067255/0132
Assignment of Assignor's Interest
Recorded: 2024-04-29
Pages: 10
Assignee
KOKUSAI ELECTRIC CORPORATION
3-4 KANDAKAJI-CHO, CHIYODA-KU, TOKYO, 101-0045, JAPAN
Covered Property
(1)
Substrate Processing Apparatus, Method of Processing Substrate, Method of Manufacturing Semiconductor Device, and Recording Medium