Patent Assignment
Reel/Frame 067255/0240
Assignment of Assignor's Interest
Recorded: 2024-04-29
Pages: 4
Assignors
HAN, SANGYOON
Executed: 2024-04-23
KIM, TAEIL
Executed: 2024-04-23
LEE, NAESEONG
Executed: 2024-04-23
LEE, MINWOO
Executed: 2024-04-23
CHANG, MIN
Executed: 2024-04-23
JANG, SEOKHYUN
Executed: 2024-04-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Heat Pump System and Method for Controlling the Same
Application:
18/649,112 →
Publication:
US 2025/0020377