Patent Assignment
Reel/Frame 067290/0229
Assignment of Assignor's Interest
Recorded: 2024-05-02
Pages: 10
Assignors
CHANG, MING-HONG
Executed: 2018-01-09
YANG, CHUN-YI
Executed: 2018-01-10
HUANG, KUN-MING
Executed: 2018-01-10
CHU, PO-TAO
Executed: 2018-01-10
WANG, SHEN-PING
Executed: 2018-01-10
KUO, CHIEN-LI
Executed: 2018-01-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Passivation Scheme for Pad Openings and Trenches