IP Library › Assignment 067291/0817
Patent Assignment
Reel/Frame 067291/0817

Change of Name

Recorded: 2024-05-02 Pages: 29
Assignor
SHOWA DENKO MATERIALS CO., LTD.
Executed: 2023-01-01
Assignee
RESONAC CORPORATION
9-1, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU, TOKYO, 105-7325, JAPAN
Covered Property (1)
Semiconductor Package
Application: 18/650,160 →
Publication: US 2024/0306308
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 30, 2024
From: TOBA, MASAYA; KURAFUCHI, KAZUHIKO; MASUKO, TAKASHI; MITSUKURA, KAZUYUKI
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 067262/0944 →