Patent Assignment
Reel/Frame 067342/0405
Assignment of Assignor's Interest
Recorded: 2024-05-08
Pages: 8
Assignors
CHENG, MING
Executed: 2023-12-04
YUAN, BUPING
Executed: 2023-12-04
YANG, CHENGPENG
Executed: 2023-12-04
HONG, YUPING
Executed: 2023-12-04
ZHANG, QINGHE
Executed: 2023-12-04
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property
(1)
Heat Conducting Member, Optical Module, Heat Sink, and Method for Preparing Heat Conducting Member
Application:
18/484,580 →
Publication:
US 2024/0040751