Patent Assignment
Reel/Frame 067388/0038
Assignment of Assignor's Interest
Recorded: 2024-05-13
Pages: 5
Assignors
PARK, CHAN JIN
Executed: 2022-02-17
PARK, JONG EUN
Executed: 2022-02-17
YANG, HYUN SEOK
Executed: 2022-02-17
CHO, SANGIK
Executed: 2011-02-17
OKADA, HIROKI
Executed: 2022-02-17
CHO, YOUNG OOK
Executed: 2022-02-17
JEON, MI JEONG
Executed: 2022-02-17
CHUNG, IN JAE
Executed: 2022-02-17
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, 16674, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Printed Circuit Board