Patent Assignment
Reel/Frame 067443/0068
Assignment of Assignor's Interest
Recorded: 2024-05-17
Pages: 8
Assignors
BOO, KELVIN TAN AIK
Executed: 2020-04-15
CHONG, CHIN HUI
Executed: 2020-04-15
YE, SENG KIM
Executed: 2020-04-15
NG, HONG-WAN
Executed: 2020-04-15
TAKIAR, HEM P.
Executed: 2020-05-12
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property
(1)
Integrated Circuit Wire Bonded to a Multi-Layer Substrate Having an Open Area That Exposes Wire Bond Pads at a Surface of the Inner Layer
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.