Patent Assignment
Reel/Frame 067451/0631
Assignment of Assignor's Interest
Recorded: 2024-05-17
Pages: 6
Assignors
CHEN, BWO-NING
Executed: 2021-07-21
WU, XUSHENG
Executed: 2021-04-06
LIANG, PIN-JU
Executed: 2020-07-21
LIU, CHANG-MIAO
Executed: 2020-07-21
LIN, SHIH-HAO
Executed: 2020-07-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods of Forming a Semiconductor Device with Corner Isolation Protection