Patent Assignment
Reel/Frame 067460/0418
Assignment of Assignor's Interest
Recorded: 2024-05-20
Pages: 6
Assignor
STMICROELECTRONICS LTD
Executed: 2024-04-03
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(2)
Optical Sensor Package with Light Shielding Material
Application:
18/607,211 →
Publication:
US 2024/0332436
Optical Sensor Package with Light Shielding Material
Application:
18/607,215 →
Publication:
US 2024/0332328
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 29, 2024
From: WANG, HUI-TZU; KUO, YIYING
To: STMICROELECTRONICS LTD
Reel/Frame 066954/0763 →
Assignment of Assignor's Interest
Mar 29, 2024
From: GANI, DAVID
To: STMICROELECTRONICS PTE LTD
Reel/Frame 066954/0777 →
Assignment of Assignor's Interest
Mar 29, 2024
From: GANI, DAVID
To: STMICROELECTRONICS PTE LTD
Reel/Frame 066954/0795 →
Assignment of Assignor's Interest
Mar 29, 2024
From: KUO, YIYING; WANG, HUI-TZU
To: STMICROELECTRONICS LTD
Reel/Frame 066954/0798 →
Assignment of Assignor's Interest
May 20, 2024
From: STMICROELECTRONICS PTE LTD
To: STMICROELECTRONICS INTERNATIONAL N.V.
Reel/Frame 067460/0366 →