OPTICAL SENSOR PACKAGE WITH LIGHT SHIELDING MATERIAL

1 . A device, comprising:

a substrate that includes a first surface opposite to a second surface, the substrate including:

a plurality of sidewalls that extend from the first surface to the second surface;

a plurality of sensor elements in the first surface;

a first through silicon via that extends from the second surface to the first surface;

a transparent layer on the first surface of the substrate, the transparent layer including:

an exposed surface that is opposite to the first surface of the substrate; and

a plurality of sidewalls that extend from the exposed surface to the first surface of the substrate;

a first layer of light shielding material that covers the second surface of the substrate, the plurality of sidewalls of the substrate, and the plurality of sidewalls of the transparent layer.

2 . The device of claim 1 , wherein the light shielding material completely covers the plurality of sidewalls of the substrate and completely covers the plurality of sidewalls of the transparent layer.

3 . The device of claim 1 , wherein the plurality of sidewalls of the substrate are coplanar with the plurality of sidewalls of the transparent layer.

4 . The device of claim 1 , comprising a second through silicon via from the second surface to the first surface, the plurality of sensor elements being between the first through silicon via and the second through silicon via.

5 . The device of claim 1 , wherein the transparent layer is glass.

6 . The device of claim 1 , comprising a second layer of light shielding material coupled between the first layer of light shielding material and the second surface of the substrate.

7 . The device of claim 6 , comprising a dielectric layer completely covering an internal surface of the first through silicon via, the dielectric layer being between the first layer of light shielding material and the second layer of light shielding material.

8 . The device of claim 7 , comprising a redistribution layer completely covering the internal surface of the first through silicon via, the redistribution layer being between the dielectric layer and the first layer of light shielding material.

9 . The device of claim 8 , comprising a contact between the first surface of the substrate and the transparent layer and coupled to the redistribution layer on the internal surface of the first through silicon via.

10 . A method, comprising:

forming a first layer of light shielding material covering a first surface of a substrate;

forming a first opening completely through the substrate and a transparent layer coupled to the substrate;

forming a second layer of light shielding material in the first opening and on the first layer of light shielding material; and

forming a second opening in the second layer of light shielding material that is in the first opening.

11 . The method of claim 10 , comprising forming a plurality of through silicon vias that extend from the first surface of the substrate to the transparent layer.

12 . The method of claim 11 , comprising forming a dielectric layer in the plurality of through silicon vias and on the first layer of light shielding material.

13 . The method of claim 11 , comprising forming a redistribution layer in the plurality of through silicon vias and partially covering the first layer of light shielding material.

14 . The method of claim 10 , wherein the second layer of light shielding material entirely fills the first opening.

15 . The method of claim 13 , comprising forming solder balls coupled to the redistribution layer.

16 . The method of claim 11 , comprising forming a plurality of gaps in the first layer of light shielding material, each of the plurality of gaps being directly over one of the plurality of through silicon vias and being wider than each of the plurality of through silicon vias.

17 . The method of claim 16 , wherein the second layer of light shielding material fills each of the plurality of gaps in the first layer of light shielding material.

18 . A device, comprising:

a substrate that includes a first surface opposite to a second surface;

a transparent layer on the first surface of the substrate, the transparent layer including:

an exposed surface that is opposite to the first surface of the substrate; and

a plurality of sidewalls that extend from the exposed surface to the first surface of the substrate;

a first layer of light shielding material that covers the second surface of the substrate, the plurality of sidewalls of the substrate, and the plurality of sidewalls of the transparent layer;

a second layer of light shielding material that is between the first layer of light shielding material and the second surface;

a first through silicon via that extends along a first direction through the second layer of light shielding material to the first surface, the first through silicon via including:

a first portion that extends along the first direction from the second surface to the first surface and has a first width along a second direction that is transverse to the first direction; and

a second portion that extends along the first direction through the second layer of light shielding material to the second surface, the second portion having a second width along the second direction that is greater than the first width of the first portion.

19 . The device of claim 18 , wherein a first portion of the second layer of light shielding material extends into the second portion of the first through silicon via.

20 . The device of claim 19 , comprising an air gap in the first through silicon via between the first portion of the second layer of light shielding material and the first surface.